Secondary Ion Mass Spectroscopic Study of Mn-Implanted Silicon after Thermal Annealing

Guangyu Chai 2Lee Chow 2Andrzej Misiuk 3Adam Barcz 1Arun Shunmugavelu 2Eun S. Choi 5Richard Vanfleet 4M. Prujszczyk 3

1. Polish Academy of Sciences, Institute of Physics, al. Lotników 32/46, Warszawa 02-668, Poland
2. University of Central Florida, Orlando, FL, United States
3. Institute of Electron Technology (ITE), al. Lotników 32/46, Warszawa 02-668, Poland
4. Brigham Young University, Provo, UT 84602, United States
5. National High Magnetic Field Laboratory (NHMFL), Tallahassee, FL 32310-3706, United States

Abstract

Re-distribution of Mn+ implanted Czochralski silicon (CzSi:Mn) and floating zone silicon (FzSi:Mn) after thermal annealing between 300ºC and 1000ºC has been studied using secondary ion mass spectrometry (SIMS). The silicon substrates were implanted with 160 keV Mn+ ion to a dose of 1×1016 cm-2 at room temperature and at 310ºC. The Mn profiles after annealing above 900ºC showed multiple concentration peaks for the samples implanted at room temperature, indicating the influence of defect structures on the diffusion behavior. For the Si sample that was implanted at 310ºC, only one concentration peak was observed. The SIMS depth profiles were compared with recent reports [1,2] of depth profiles of Mn implanted silicon. We also carried out cross sectional TEM and magnetization measurements to correlate the micro-structural and magnetization data with depth profile obtained by SIMS.

[1] M. Bolduc, C. Awo-Affouda, F. Ramos, and V. P. LaBella, J. Vac. Sci. Technol. A 24(4), 1648 (2006).

[2] A. Misiuk, J. Bak-Misiuk, B. Surma, W. Osinniy, M. Szot, T. Story, J. Jagielski, J. Alloys Comp., 423, 201 (2006).

Presentation: Poster at Joint Fith International Conference on Solid State Crystals & Eighth Polish Conference on Crystal Growth, by Lee Chow
See On-line Journal of Joint Fith International Conference on Solid State Crystals & Eighth Polish Conference on Crystal Growth
Submitted: 2007-01-14 01:49
Revised:   2007-05-09 21:23
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