Structure and thermal properties of epoxy resins nano-composites with flame retardants

Joanna Ryszkowska 1Ida Dulińska 1Bartłomiej J. Waśniewski 1Maciej Heneczkowski 2Krzysztof J. Kurzydlowski 1

1. Warsaw University of Technology, Faculty of Materials Science and Engineering (InMat), Wołoska 141, Warszawa 02-507, Poland
2. Rzeszów University of Technology, Dept of Plastic Technology, W.Pola 2, Rzeszów 35-011, Poland

Abstract

Nano-composites exhibit advantageous mechanical and physical properties already at small additions of modifying particles, frequently lower than 5 wt %. The present studies focused on polymeric nano-composites containing flame retardant nano-clay. The matrix used in the present study was a two-component low-molecular-weight epoxy resins. Such a matrix is used to fabricate composite structures used in aviation. As a filler, three types of modified natural montmorillonite (MMT) and various types of commonly used flame retardants were employed. The aim of the study was to develop flame retardant nano-composites containing the lowest possible amount of flame retarding fillers. To this end, a series of nanocomposites with MMT and flame retardants were fabricated.
The nano-composites produced in the present study were subjected to extensive studies of the mechanical and thermal properties. Among others, such mechanical properties were measured as elastic modulus, tensile strength and ultimate elongation. The thermal properties of the cured epoxy resin were characterized via thermogravimetric analysis. The fire reaction properties were measured using a cone calorimeter. The properties of the samples have been correlated to their microstructure, studied on images revealed on cross sections and investigated by HRSEM and AFM.

This research was financed by the Polish State Committee for Scientific Research (PBZ-KBN-095/T08/2003).

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Presentation: Poster at E-MRS Fall Meeting 2006, Symposium D, by Bartłomiej J. Waśniewski
See On-line Journal of E-MRS Fall Meeting 2006

Submitted: 2006-05-15 13:49
Revised:   2006-05-15 13:49
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