NANOCRYSTALLINE Cu-Al2O3 COMPOSITES SINTERED BY THE PULSE PLASMA TECHNIQUE
|Marcin Rosinski 1, Andrzej Michalski 1, Jakub Jaroszewicz , Dariusz Siemiaszko , Krzysztof J. Kurzydlowski 1|
1. Warsaw University of Technology, Faculty of Materials Science and Engineering (InMat), Wołoska 141, Warszawa 02-507, Poland
The paper presents the results of examinations of the structure and properties of the nanocrystalline Cu-Al2O3 composites with the two different Al2O3 contents: 10vol.% and 20vol.%. The composites were produced using a mixture of copper and Al2O3 powders with an average crystallites size of about 60nm in Cu and about 40nm in Al2O3. The powders were consolidated by pulse plasma sintering (PPS) at a temperature of 650oC under a load 60 MPa for 5min. Irrespective of the volumetric content of Al2O3, the relative density of the composites is about 92%, and the average Cu crystallite size is about 80nm. The hardness of the composites varies with the volumetric content of Al2O3, and is equal to 250HV0.1 with 20% of Al2O3 and to 220HV0.1 with 10% of Al2O3. The Cu-20%Al2O3 composite has a resistivity of 0.386µΩm and the composite with 10% of Al2O3 - a resistivity of 0.149µΩm.
Presentation: poster at E-MRS Fall Meeting 2005, Symposium I, by Jakub Jaroszewicz
See On-line Journal of E-MRS Fall Meeting 2005
Submitted: 2005-05-18 11:12 Revised: 2009-06-07 00:44
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