Vinzenz Bissig

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interest(s):

Affiliation:


Empa, Materials Technology and Research

address: Überlandstrasse 129, Dübendorf, 8600, Switzerland
phone: ++41 44 8234529
fax: +41 44 8234039
web:

Participant:


E-MRS Fall Meeting 2005

began: 2005-09-05
ended: 2005-09-09
Presented:

E-MRS Fall Meeting 2005

Comparison of three different active filler metals used for brazing ceramic-to-ceramic and ceramic-to-metal joints


E-MRS Fall Meeting 2005

Development of nanoparticle reinforced brazing filler metals and solders: the aspects of downscaling from micro to nanoscale


Participant:


E-MRS Fall Meeting 2009

began: 2010-09-14
ended: 2010-09-18
Presented:

E-MRS Fall Meeting 2009

How to join heat sensitive materials?

Publications:


  1. How to join heat sensitive materials?
  2. Comparison of three different active filler metals used for brazing ceramic-to-ceramic and ceramic-to-metal joints

  3. Development of nanoparticle reinforced brazing filler metals and solders: the aspects of downscaling from micro to nanoscale

  4. Fractography as a tool to optimize joint design and the brazing process

  5. Optimization of particle reinforced lead-free solders




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