Jolanta Janczak-Rusch

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Affiliation:


Empa, Materials Technology and Research

address: Überlandstrasse 129, Dübendorf, 8600, Switzerland
phone: ++41 44 8234529
fax: +41 44 8234039
web:

Affiliation:


Empa Materials Science and Technology

address: Überlandstrasse 129, Dübendorf, 8600, Switzerland
phone: +41 44 823 55 11
fax: +41 44 821 6244
web: http://www.empa.ch

Participant:


E-MRS Fall Meeting 2005

began: 2005-09-05
ended: 2005-09-09
Presented:

Publications:


  1. Experimental evaluation of melting point depression in AlSi/AlN nanomultilayer system
  2. How to join heat sensitive materials?
  3. Comparison of three different active filler metals used for brazing ceramic-to-ceramic and ceramic-to-metal joints

  4. Description of the mechanical performance of Cu-SnAgCu-Cu joints

  5. Development of nanoparticle reinforced brazing filler metals and solders: the aspects of downscaling from micro to nanoscale

  6. Evaluation of fibre-cement interfacial properties by SEM-based push-out tests

  7. Fractography as a tool to optimize joint design and the brazing process

  8. Microstructural evaluation during particles addition to lead-free solders

  9. Model for intermetallic phase and intermetallic compound solidification during diffusion soldering

  10. On the Relief of the Residual Stresses in Ceramic-Metal Joints by a Layered Braze Structure

  11. Optimization of particle reinforced lead-free solders

  12. Size and constraining effects in lead-free solder joints

  13. The Wetting Behaviour and Interface Structure of Unreinforced and Particle Reinforced Lead-Free Solders

  14. Transition from solidification to the first solid/solid transformation during diffusion soldering




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