Ammonothermal growth of thick gallium nitride films

Yuji Kagamitani 1Dirk Ehrentraut 1Naruhiro Hoshino 1Akira Yoshikawa 1Tsuguo Fukuda 1Hirohisa Itoh 2

1. Institute of Multidisciplinary Research for Advanced Materials (IMRAM), Sendai 980-8577, Japan
2. Mitsubishii Chemical Corp., Ibaraki 300-1295, Japan

Abstract

A major drawback in GaN technology is the lack of large-size, single-crystalline GaN substrates of high quality, i.e. less than the 107 dislocations per cm-2 at present, due to thermal-expansion and lattice-parameter mismatch between GaN-based film and foreign substrates like α-Al2O3 (sapphire) or SiC. High-pressure (>100 MPa), solvothermal techniques are well established and currently providing the largest crystals of α-SiO2 and ZnO from supercritical (SC) aqueous solutions. In the case of GaN, SC ammonia (NH3) is employed as solvent. We have produced single-crystalline GaN films of < 200 mm in thickness on 1 cm2 large, HVPE-grown (0001) GaN substrates employing NH4Cl as mineralizer for solubility enhancement. System pressures < 170 MPa were applied. The average growth speed ranging 5 to 30 mm/day over longer growth runs is observed for the film growth on the (000-1) face. The maximum growth speed was achieved for the film grown at a supersaturation from a combined Ga/GaN precursor. The surface morphology of the grown film is not affected by the nature of the precursor, i.e. Ga metal or GaN

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Presentation: Poster at Joint Fith International Conference on Solid State Crystals & Eighth Polish Conference on Crystal Growth, by Yuji Kagamitani
See On-line Journal of Joint Fith International Conference on Solid State Crystals & Eighth Polish Conference on Crystal Growth

Submitted: 2007-01-19 06:16
Revised:   2007-05-09 22:00
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