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Sensoric effect of Langmuir - Blodgett films based on fluorene derivatives - TCNQ CT - complex

Joanna Cabaj ,  Jadwiga Sołoducho ,  Antoni Chyla ,  Anna Nowakowska 

Wrocław University of Technology, Department of Chemistry, Wybrzeże Wyspiańskiego 27, Wrocław 50-370, Poland

Abstract
The construction of conducting material with increasing complexicity exhibiting a precise architecture, size, shape and functionality is a challenging domain of rapidly growing interest. It founds its incentives in the increasing needs for molecular and sensoric devices which accompany the developmnet of nanotechnologies1.

A major support for the advancement in the design of functional molecular objects is our improving ability to control their macromolecular structure in great detail often by using proper deposition methods (Langmuir - Blodgett). In the last two decades there has been an increasing interest in electroactive molecules arranged in thin films, due to their capability for the development of electronic and sensoric devices2.

Continuing our considerable interest in precursors of conducting and sensing materials chemistry3 stimulated us to present the results of research into the properties of LB films containing TCNQ. TCNQ as well as its derivatives focus on extesively use as electron acceptor in a large number of organic conducting system. The present work pointed on results of measurement of the effect of toxic gases on CT complex LB film gas sensor. The monitored changes of the surface dark conductivity of sensor made of fluorene derivatives with TCNQ due to adsorption of toxic gases.

1. Schappacher M., Deffieux A., Macromolecules, 2005, 38, 7209-7213

2. Hirano Ch., Imae T., Fujima S., Yanagimoto Y., Takaguchi Y., Langmuir, 2005, 21, 272 279

3. Cabaj J., Sołoducho J., Nowakowska A., Chyla A., Electroanalysis Journal, 2006, 18 (8), 801-806

 

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Related papers

Presentation: Poster at E-MRS Fall Meeting 2006, Symposium J, by Anna Nowakowska
See On-line Journal of E-MRS Fall Meeting 2006

Submitted: 2006-05-15 21:18
Revised:   2009-06-07 00:48