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The electrocrystallization of nanonickel

Benigna Szeptycka ,  Anna Gajewska - Midziałek ,  Daniela Derewnicka 

Institute of Precision Mechanics, Duchnicka 3, Warszawa 01-796, Poland

Abstract

The micro- and nanostructure, microhardness and wear resistance was investigated for d.c. - plated Ni electrodeposits prepared from high- and low-concentrated Watts electrolytes, also with KCl instead of NiCl2, without or with organic compounds on Cu substrate, which was subsequently removed from the deposits. Increase of current density and temperature caused increase of grain dimensions and decrease of wear resistance. With the change of the type of bath, particularly with organic compounds, the deposit grain size was found to decrease markedly, until obtain of deposits with an average grain size of about 20 and 50 nm. In this set of investigations the wear resistance decreased with decreasing grain size. In discussing the factors controlling the deposit grain size, it is concluded that content in the bath of the organic compounds may have a decisive role.

 

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Related papers

Presentation: poster at E-MRS Fall Meeting 2003, Symposium G, by Benigna Szeptycka
See On-line Journal of E-MRS Fall Meeting 2003

Submitted: 2003-05-05 13:53
Revised:   2009-06-08 12:55