The effect of intermetallic compound on shear strength of diffusion soldered interconnections

Joanna Wojewoda ,  Paweł Zięba 

Polish Academy of Sciences, Institute of Metallurgy and Materials Sciences (IMIM PAN), Reymonta 25, Kraków 30-059, Poland

Abstract

The study presents capabilities of diffusion – soldering technology as an simple way to achieve mechanically stable interconnections which can be useful especially in electronic equipment. The joint is formed due to isothermal solidification and subsequent diffusion in solid state and it consisits of one or more intermetallic phases with melting temperatures much higher than the temperature used for the fabrication of the joint. The diffusion soldering is also a potential candidate for replacement of harmful Pb-Sn solders. In the present study the process was applied to join the copper substrates by the thin foil of low melting materials – either In-Bi (72 C) or In-Sn (119 C) eutectic alloys.

INSTRON tensile testing machine was used for shear strength tests of the joints fabricated in the broad range of the temperatures (100 – 300 C). Scanning Electron Microscopy investigation was used to identify the intermetallics present in the interconnection area and also to describe the fracture surface after the mechanical test.

Presentation: oral at E-MRS Fall Meeting 2005, Symposium H, by Joanna Wojewoda
See On-line Journal of E-MRS Fall Meeting 2005

Submitted: 2005-05-24 14:05
Revised:   2009-06-07 00:44
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