Sn-4.0Ag-0.5Cu lead-free solder was used for the joining Cu plates of 1 mm in thickness. A combined theory-experiment approach was applied to describe the mechanical performance of the solder joints. Experimental data for solder joints with different gap widths (0.1-1mm) were obtained in tensile tests. The resulting stress-strain curves showed an increase both in tensile strength and in yield strain with increasing gap widths. The joints with a gap thickness of 1mm were considered as reference joints for finite element simulations in which an elasto-visco-plastic behaviour of the solder was assumed. By comparing theoretical and experimental results (force-displacement characteristics) to the reference joints the constitutive behaviour of the solder was identified. The resulting model parameters were then used to predict the solder joint behaviour for defined geometrical constraints. Considering the inherent differences between specimens, due to processing and local defects, a good agreement between the theoretical and experimental data was found for the effect of the gap thickness.

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