Description of the mechanical performance of Cu-SnAgCu-Cu joints

Aissa Mellal 1Thomas Rütti 2John Botsis 1Jolanta Janczak-Rusch 2

1. Ecole Polytechnique Federale de Lausanne (EPFL), Ecublens, Lausanne 1015, Switzerland
2. Empa, Materials Technology and Research (Empa), Überlandstrasse 129, Dübendorf 8600, Switzerland

Abstract

Sn-4.0Ag-0.5Cu lead-free solder was used for the joining Cu plates of 1 mm in thickness. A combined theory-experiment approach was applied to describe the mechanical performance of the solder joints. Experimental data for solder joints with different gap widths (0.1-1mm) were obtained in tensile tests. The resulting stress-strain curves showed an increase both in tensile strength and in yield strain with increasing gap widths. The joints with a gap thickness of 1mm were considered as reference joints for finite element simulations in which an elasto-visco-plastic behaviour of the solder was assumed. By comparing theoretical and experimental results (force-displacement characteristics) to the reference joints the constitutive behaviour of the solder was identified. The resulting model parameters were then used to predict the solder joint behaviour for defined geometrical constraints. Considering the inherent differences between specimens, due to processing and local defects, a good agreement between the theoretical and experimental data was found for the effect of the gap thickness.

 

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Presentation: poster at E-MRS Fall Meeting 2005, Symposium H, by Aissa Mellal
See On-line Journal of E-MRS Fall Meeting 2005

Submitted: 2005-05-24 07:47
Revised:   2009-06-07 00:44