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Potentiometric response of copper-sensitive sensors based on PEDOT-Arsenazo films.

Barbara Źrałka 1Teresa Błaż 1Jan Migdalski 1Andrzej Lewenstam 1,2

1. AGH University of Science and Technology (AGH), al. Mickiewicza 30, Kraków 30-059, Poland
2. Abo Akademi University, Center for Process Analytical Chemistry and Sensor Technology ProSens (PROSENS), Biskopsgatan 8, Turku 00410, Finland

Abstract

   A new method of preparation of the copper sensitive PEDOT-Arsenazo films is shown. The Arsenazo ligands were introduced to the PEDOT film during electrodeposition. By subsequent soaking in CdSO4 solution Cd(II) ions were introduced. Finally, after conditioning in the CuSO4 solution copper ions were introduced via ion-exchange. In this way the PEDOT-Arsenazo films became sensitive to Cu(II) ions. Described mechanism was fully supported by ESCA spectra which confirmed the presence of arsenic inside film after electrodeposition, presence of cadmium after soaking in CdSO4 solution and exchange of cadmium with copper ions after subsequent soaking with CuSO4 solution.  Additionally, potentiometric measurements have shown that cadmium sensitivity induced during soaking in CdSO4 solution disappeared after subsequent soaking in  CuSO4 solution and the films became copper sensitive after that. 

Chloride influence on the potentiometric response of the copper sensitive PDEOT-Arsenazo films was investigated by potentiometric, voltammetric and ESCA measurements. It has been shown that observed changes of slope and standard potential can be attributed to increasing content of Cu+1 or/and Cu0 inside the film after its contact with chloride ions.

Some practical applications of  the copper sensitive films are shown to illustrate behaviour and analytical advantages of presented sensors.

Financial support from KBN, project 3T08E 085 30  is gratefully acknowledged.

 

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Related papers

Presentation: Poster at SMCBS'2007 International Workshop, by Jan Migdalski
See On-line Journal of SMCBS'2007 International Workshop

Submitted: 2007-09-06 14:51
Revised:   2009-06-07 00:44