E-MRS Fall Meeting 2005

 on-line journal

Time
Duration
Type
Presenting person
Title

September 5th, Monday

15:50 Monday Poster Session
15:50 #H-1 poster Herbert Ipser

ELFNET: A European Network on Lead Free soldering

15:50 #H-2 poster Adela Zemanova

Interaction of Ag-In-Sn Solders with Palladium Substrates: A Phase Diagram Approach

15:50 #H-3 poster Artur Kudyba

Comparison of wetting and mechanical properties of Cu/Sn-based solder couples produced under vacuum and under flux

15:50 #H-4 poster Aissa Mellal

Description of the mechanical performance of Cu-SnAgCu-Cu joints

15:50 #H-5 poster Stefan F. Awietjan

Optimization of particle reinforced lead-free solders

15:50 #H-6 poster Vinzenz Bissig

Development of nanoparticle reinforced brazing filler metals and solders: the aspects of downscaling from micro to nanoscale

15:50 #H-7 poster Viorel T. Braic

Ti layer ion assisted deposition in metal ceramic bonding

15:50 #H-8 poster Waldemar Wołczyński

Model for intermetallic phase and intermetallic compound solidification during diffusion soldering

15:50 #H-9 poster Andrian V. Kuchuk

Relationship between condition of deposition and properties of W-Ti-N thin films prepared by reactive magnetron sputtering

15:50 #H-10 poster Waldemar Ziaja

Tensile deformation behaviour of the titanium alloy with hard elastic coating

15:50 #H-11 poster Maciej Lachowicz

Characteristics of welded joints and cracks occurred during pad welding of superalloy Inconel 713C

15:50 #H-12 poster Jerzy Nowacki

Structure and properties of joints of 14-5 PH steel and PM Fe-TiC composite using filler metal BNi2/MBF 20

15:50 #H-13 poster Rafal Nowak

The Wetting Behaviour and Interface Structure of Unreinforced and Particle Reinforced Lead-Free Solders

September 6th, Tuesday

09:00 Parallel Session - Main Building, room 144
09:00 00:30:00 oral Herbert Ipser

Developing New Lead-free Solder Materials: COST 531, a Concerted European Action

09:30 00:20:00 oral Jiri Vizdal

The Experimental and Theoretical Study of the Pd-Sn-Zn System

09:50 00:20:00 oral Joël Cugnoni

Size and constraining effects in lead-free solder joints

10:10 00:20:00 oral Pascal P. Jud

Local fatigue in lead-free SnAg3.8Cu0.7 solder

14:00 Parallel Session - Main Building, room 144
14:00 00:30:00 oral Matthias Tuerpe

Evaluation of lead free soldering development by means of a holistic consideration

14:30 00:20:00 oral Paulina Unifantowicz

Microstructural evaluation during particles addition to lead-free solders

14:50 00:20:00 oral Sang Wan Cho Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge
15:10 00:20:00 oral Oliver von Trzebiatowski

Microelectrochemical corrosion studies on lead-free Sn-Ag-Cu solder alloys

15:50 Parallel Session - Main Building, room 144
15:50 00:20:00 oral Joanna Wojewoda

The effect of intermetallic compound on shear strength of diffusion soldered interconnections

16:10 00:20:00 oral Waldemar Wołczyński

Transition from solidification to the first solid/solid transformation during diffusion soldering

16:30 00:20:00 oral Johannes Wilden

Influence of alloying elements on diffusion welding of light weight hybrid joints

16:50 00:20:00 oral Erick Stoll

Progresses in the characterisation of structural oxide/oxide ceramic matrix composites fabricated by electrophoretic deposition

September 7th, Wednesday

09:00 Parallel Session - Main Building, room 144
09:00 00:30:00 invited oral Manfred Boretius

Potential Vacuum Brazing – State of the art and developments from the perspective of a service contractor

09:30 00:20:00 oral Vinzenz Bissig

Comparison of three different active filler metals used for brazing ceramic-to-ceramic and ceramic-to-metal joints

09:50 00:20:00 oral Jakob J. Kuebler

Fractography as a tool to optimize joint design and the brazing process

10:10 00:20:00 oral Ivo Utke

Attachment of carbon nanotubes to AFM tips: Strength of carbonaceous and metal containing joints

14:00 Parallel Session - Main Building, room 144
14:00 00:30:00 invited oral Heinrich Kern

Composites with tailorable isotropic near-zero thermal expansion

14:30 00:20:00 oral Matteo Galli

On the Relief of the Residual Stresses in Ceramic-Metal Joints by a Layered Braze Structure

14:50 00:20:00 oral Oleg Barabash

Residual Stresses, Thermomechanical Behavior and Interfaces in the Weld Joint of Ni-based Superalloys

15:50 Wednesday Poster Session
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